he Delid-Die-Mate Intel 13th Gen is a tool for removing the heat spreader ("delidden") on Intel processors for socket LGA1700. By removing the heat spreader, the CPUs can be cooled via "direct die", for example. With the so-called "direct die", the CPU cooler is mounted directly on the processor chip. By omitting the heat spreader in the cooling circuit, a significantly optimised heat transfer from the die to the CPU cooler is possible.
Why "Delidding" & Direct Die method for Intel processors?
Delidding is the process of removing the processor's heat spreader. On unsoldered processors, delidding is typically used to replace the thermal interface material (TIM) between the CPU die and the heat spreader with high-quality thermal compound or liquid metal before the heat spreader is reinstalled. However, since the 13th generation Intel Core processors are soldered, this is not an option, as removing the indium solder would create too large a gap between the IHS and CPU dies.
Therefore, the 13th/14th Gen Intel Core CPUs are primarily delidded for possible mounting of the CPU cooler directly on the CPU dies. By omitting the heat spreader and mounting the CPU cooler directly on the dies, experience shows that temperatures can be reduced by 10-15 °C if liquid metal such as Conductonaut is used as TIM. A corresponding test with an Intel Core i9-13900K was carried out by content creator and Tech-YouTuber Roman "der8auer" Hartung, professional overclocker and engineer.
Attention: Removing the heatspreader ("delidding") of a processor is at your own risk! Heading the CPU voids the manufacturer's warranty! Damage caused by decapping the CPU is not covered by the manufacturer!
The HEATKILLER® V eBC backplate is a useful addition for the HEATKILLER® V VGA water blocks. Mounted on the backside of the graphics card, it improves the cooling performance while also granting mechanical stability. This is due to the construction out of massive black anodized aluminum. Even more, it also just looks good.
The backplate cools relevant components on the PCB’s backside, including GPU, RAM, and voltage regulation (VRM). Pre-cut thermal pads are included in the scope of delivery.
Isolating spacers on the backside of the backplate ensure easy installation.
The enclosed mounting material is optimized for usage with HEATKILLER® V water blocks. The backplate can be used with water blocks of other manufacturers. You might need to modify the mounting material, though. This is not part of the delivery scope.
Technical data:
Material: Anodized aluminum
Dimensions (L x W x H):
Weight: 150g
Compatible with:
EVGA Geforce RTX 3080/3090 XC3
Please consult the compatibility chart at http://gpu.watercool.de
Scope of delivery:
1x HEATKILLER® V eBC - Backplate for RTX 3080/3090 EVGA XC3 - Black
1x Mounting material


![]() |
In stock |
![]() |
2 to 5 days delay |
![]() |
1 to 2 weeks delay |
![]() |
unknow delay |
![]() |
pre-order |
$('#basket').addClass('emptypanier');

