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The Conductonaut Extreme liquid metal thermal compound is the further development of Conductonaut and was developed for applications with maximum power density. As a gallium-based liquid metal, Conductonaut Extreme is a metallic alloy that is liquid at room temperature, allowing for the minimum possible layer thickness.
Conductonaut Extreme thermal paste is technically not a thermal paste, as a paste consists of liquid and solid particles. The disadvantage of a paste is the solid particles. The surfaces of the base plate of the CPU cooler and the CPU heat spreader are uneven on a microscopic level. A traditional thermal paste fills these irregularities unevenly. Since the solid particles are larger than the gaps caused by the unevenness, more distance must be filled between the cooler and the heat spreader.
A heat-conducting medium in the form of liquid metal does not have this problem because it does not contain any "large" particles. As a result, the surfaces of the CPU cooler and heat spreader are closer together. At the same time, liquid metal has a constant heat transfer, while the larger solid particles in pastes usually conduct heat better than the paste parts. Liquid metal is preferable to thermal paste, especially in high energy applications.
Conductonaut Extreme is manufactured to the highest quality standards at our production site in Germany. Our expertly trained staff continuously monitor the entire production chain. From testing the purity of the raw material, to the production of the liquid metal and filling, to packaging, production is subject to multiple quality controls.
Conductonaut Extreme is recommended as a high-end product for experienced users who are looking for a solution with best heat dissipation in the temperature range above 8°C. We recommend applying Conductonaut Extreme on nickel-plated copper as this offers the best long-term stability
Attention:
Conductonaut Extreme thermal paste must not be used with aluminium coolers!
Scope of delivery
Arctic Silver Thermal Epoxy is a high-performance, permanent adhesive designed for bonding heat sinks and cooling solutions to electronic components.
Thanks to its two-component epoxy technology, it offers exceptional thermal conductivity while forming a strong and durable bond.
Ideal for CPUs, graphics cards, RAM heat sinks, and other electronic devices, Arctic Silver Thermal Paste ensures efficient heat transfer between components and the cooling system.
Once cured, it forms a durable, insulating bond, making it ideal when mechanical fasteners are not feasible.
Key Features:
- High-performance, two-component thermal epoxy adhesive
- Provides excellent thermal conductivity
- Forms a permanent and durable bond for heat sinks and components
- Electrically insulating for safe application
- Ideal for cooling CPUs, graphics cards, RAM heat sinks, and integrated circuits. - Easy 1:1 mixing ratio for simple application
- Weight: 6 g (2 x 3 g syringes)
Preparation and Application
Ensure surfaces are clean, dry, and free of grease or residue.
Mix equal parts of the contents of each syringe (1:1 ratio) on a clean surface.
Apply a thin, even layer to the component and heat sink.
Carefully position the object – the epoxy forms a permanent bond once cured.
Allow 5 minutes for the paste to reach the desired consistency; fully cured in 24 hours.
Do not use excessive amounts, as this may reduce performance.
Precautions
Permanent adhesive not intended for temporary mounting.
Avoid contact with skin and eyes; wear gloves when using.
Use in a well-ventilated area.
Keep out of reach of children. Store in a cool, dry place and close tightly after use.
Arctic Silver thermal epoxy is formulated to conduct heat, not electricity.
Although specifically designed for high electrical resistance, it should be kept away from traces, pins, and electrical conductors.
Cured epoxy is slightly capacitive and could potentially cause problems if it were to short-circuit two nearby electrical circuits.
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