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This Thermal pad is ideal for any type of component such as memory chip, mosfet, chipset, waterblock, etc ... because it offers excellent thermal conductivity of 12W / mk!
It has been designed in a specific material so that it does not slip when you apply it to a component, its surface being slightly sticky.
It will adapt very easily to all surfaces and will bridge any differences in level.
Technical characteristics : Grey color Dimensions: 60x50mm Thermal conductivity: 12 W / mk Thickness: 0.5mm Density (g / cc): 3.4 Tensile strength (Psi): 6.8 Elongation (%): 12% Operating temperature (° C): -40 to 250 Not electrically conductive Can be cut easily Do not use for processor or GPU of graphics cards
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