The Eisschicht from Alphacool can, like other heat thermal pads, compensate for the unevenness of heat sinks and the elements to be cooled. However, it has a great special feature: the Eisschicht consists of heat-conducting paste with a fabric embedded in it! This ensures that the performance of these pads is significantly more efficient than that of normal heat conduction pads, regardless of the low W/mK value. Furthermore, a better distribution and filling between the surfaces is achieved. This results in a better air displacement and due to their soft consistency, there is also no pressure on components or solder joints. Nvidia, uses this type of pad wth the Founders Edition GPUs. Eisschicht can easily be cut to the desired size and attached to heat sinks without slipping.
As a basic component or spare part, heat conduction pads belong in every well-organised computer builder’s toolbox!
Technical data:
The Alphacool Apex Thermal Putty is a high-performance solution for efficiently transferring heat from heat-sensitive electronic components to a cooler. As a non-hardening silicone gel, it offers an electrically non-conductive alternative to conventional thermal pads and is designed for applications where flexibility, low mechanical stress, and high thermal conductivity are required.
A key advantage of the Apex Thermal Putty lies in its optimized consistency, which ensures both ease of application and dimensional stability. Under light pressure, the material adapts precisely to different gap heights while remaining form-stable. This allows surface irregularities and tolerances between the cooler and the component to be reliably compensated, ensuring consistent and optimal contact between the heat source and the cooler. This is particularly important for modern graphics cards and other sensitive electronic components, as delicate parts such as memory chips or voltage regulators are effectively protected from mechanical damage.
The formulation of the Alphacool Apex Thermal Putty combines high thermal conductivity with a reduced bond line thickness (BLT), thereby lowering thermal resistance and improving heat dissipation. Bond line thickness refers to the thickness of the thermal interface material layer between the component and the cooler. At the same time, high vertical stability and long-term stable material properties ensure lasting material integrity without sagging, cracking, or contamination of surrounding components, making the product ideal for professional applications.
Thanks to these characteristics, the Alphacool Apex Thermal Putty offers a wide range of applications. Wherever reliable, flexible, and mechanically gentle thermal transfer is required, Apex Putty provides a powerful solution.
| Technical Data | |
| Flow Rate (g/min) | 20 (Test Method: 30cc EFD tube/ 2.5mm nozzle, 90 psi) |
| Density (g/cc) | 3.8 (Test Method ASTM D792) |
| Minimum Bondline Thickness (mm) | 0.2mm |
| Continuous Using Temperature (Degrees Celsius) | -20 ~ 125 °C |
| Thermal Conductivity (W/mK) | 10 (Test Method ASTM D5470) |
| Volume Resistivity (Ohm-cm) | >/= 1.0X1013 (Test Method ASTM D257) |
| Dielectric Strength (KV/mm) | >/= 5 (Test Method ASTM D149) |
| Weight | 30g |
| Color | Blue-Grey |


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